@ARTICLE{benedekTIE13,
author={Benedek, C. and Krammer, O. and Jan\'oczki, M. and Jakab, L.},
journal={IEEE Transactions on Industrial Electronics}, title={Solder Paste Scooping Detection by Multi-Level Visual Inspection of Printed Circuit Boards},
year={2013},
month={June},
volume={60},
number={6}, 
keywords={Feature extraction;Hidden Markov models;Histograms;Inspection;Printed circuits;Soldering;Marked point process (MPP);printed circuit board (PCB);scooping;},
doi={10.1109/TIE.2012.2193859},
ISSN={0278-0046},
}